US 12,219,690 B2
Damper system for a lidless integrated circuit
Robert Morris Wilcox, Saratoga, CA (US); Tiffany Doria, Fremont, CA (US); and Steven Alf Hanssen, San Jose, CA (US)
Assigned to Arista Networks, Inc., Santa Clara, CA (US)
Filed by Arista Networks, Inc., Santa Clara, CA (US)
Filed on Aug. 31, 2021, as Appl. No. 17/462,680.
Prior Publication US 2023/0067409 A1, Mar. 2, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0203 (2013.01) [H05K 7/20709 (2013.01); H05K 2201/2045 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A processing unit comprising:
a printed circuit board (PCB) having first and second opposite sides and comprising a lidless integrated circuit mounted on the first side of the PCB;
a heatsink in thermal communication with the lidless integrated circuit via only one thermal interface material, wherein the heatsink includes a first vapor chamber on the first side of the PCB and a second vapor chamber on the second side of the PCB and wherein a protrusion of the first vapor chamber is thermally coupled to a protrusion of the second vapor chamber; and
a damper system compressed between the PCB and the heatsink and surrounding the lidless integrated circuit to absorb a portion of kinetic energy imparted to the lidless integrated circuit by an impact to the processing unit, wherein the damper system comprises an elastomer material that contacts the heatsink.