CPC H05B 3/0047 (2013.01) [F27B 17/0025 (2013.01); F27D 11/12 (2013.01); H01L 21/67115 (2013.01)] | 6 Claims |
1. A heat treatment apparatus for heating a disk-shaped substrate by irradiating the substrate with light, comprising:
a chamber that houses a substrate;
a holding part that holds a substrate in said chamber;
a light irradiation part in which a plurality of rod-shaped lamps are arranged in a region that is greater than a major surface of the substrate held by said holding part and that opposes the major surface;
a cylindrical first louver that is provided between said light irradiation part and said holding part, with a central axis of said first louver passing through a center of said substrate, and that is impervious to the light emitted from said light irradiation part; and
a cylindrical second louver that is provided between said light irradiation part and said holding part, with a central axis of said second louver passing through the center of said substrate, and that is impervious to the light emitted from said light irradiation part,
wherein said first louver and said second louver have the same height,
said first louver has an inner diameter greater than an outer diameter of said second louver, and
said second louver is located inward of said first louver.
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