US 12,219,337 B2
Conductive film for sound producing apparatus and sound producing apparatus
Guodong Zhao, Weifang (CN); and Chaofeng He, Weifang (CN)
Assigned to Goertek Inc., Shandong (CN)
Appl. No. 17/636,767
Filed by Goertek Inc., Weifang (CN)
PCT Filed Dec. 26, 2019, PCT No. PCT/CN2019/128551
§ 371(c)(1), (2) Date Feb. 18, 2022,
PCT Pub. No. WO2021/031496, PCT Pub. Date Feb. 25, 2021.
Claims priority of application No. 201910764584.2 (CN), filed on Aug. 19, 2019.
Prior Publication US 2022/0279279 A1, Sep. 1, 2022
Int. Cl. H04R 7/12 (2006.01); H04R 9/06 (2006.01)
CPC H04R 7/125 (2013.01) [H04R 9/06 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A conductive film for a sound producing apparatus, comprising:
a conductive layer having first and second surfaces, and two or more substrate layers, wherein:
the two or more substrate layers comprise two first substrate layers directly bonded to the conductive layer, the two first substrate layers comprising a thermoplastic elastomer,
the two first substrate layers are hot pressed connected with the conductive layer,
the thermoplastic elastomer is hot pressed to form a viscous flow state, such that the two first substrate layers and the conductive layer are combined together without an adhesive, and
the thermoplastic elastomer is non-conductive; and
a conductive circuit etched on the second surface of the conductive layer, wherein:
a first one of the two first substrate layers is hot pressed connected with the first surface of the conductive layer,
one of the two first substrate layers and the conductive layer are rolled, and
a second one of the two first substrate layers is hot pressed connected with the second surface of the conductive layer and the first one of the two first substrate layers.