US 12,219,333 B2
Method of manufacturing acoustic devices with improved sensitivity
Guofeng Chen, Fremont, CA (US); Michael Jon Wurtz, Lake Oswego, OR (US); Rakesh Kumar, Singapore (SG); You Qian, Singapore (SG); and Humberto Campanella-Pineda, Singapore (SG)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on May 18, 2022, as Appl. No. 17/664,023.
Claims priority of provisional application 63/202,596, filed on Jun. 17, 2021.
Claims priority of provisional application 63/202,599, filed on Jun. 17, 2021.
Prior Publication US 2022/0408208 A1, Dec. 22, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04R 31/00 (2006.01); B81B 3/00 (2006.01); H04R 3/00 (2006.01); H04R 17/02 (2006.01); H10N 30/05 (2023.01); H10N 30/30 (2023.01); H10N 30/50 (2023.01); H10N 30/87 (2023.01)
CPC H04R 31/006 (2013.01) [B81B 3/0021 (2013.01); H04R 3/00 (2013.01); H04R 17/02 (2013.01); H10N 30/05 (2023.02); H10N 30/302 (2023.02); H10N 30/306 (2023.02); H10N 30/50 (2023.02); H10N 30/872 (2023.02); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of making a piezoelectric sensor for a piezoelectric microelectromechanical systems microphone, comprising:
forming or depositing one or more piezoelectric layers to define a beam extending between a proximal portion and a distal tip, the beam having a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion; and
attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal tip is a free unsupported end of the beam.