US 12,219,312 B2
Apparatus and method for MEMS microphone performance via back volume
Sullivan Do, Ypsilanti, MI (US); and Yu Du, Chicago, IL (US)
Assigned to Harman International Industries, Incorporated, Stamford, CT (US)
Filed by Harman International Industries, Incorporated, Stamford, CT (US)
Filed on Nov. 22, 2023, as Appl. No. 18/517,963.
Application 18/517,963 is a division of application No. 17/499,440, filed on Oct. 12, 2021, granted, now 11,863,925.
Prior Publication US 2024/0089644 A1, Mar. 14, 2024
Int. Cl. H04R 1/04 (2006.01); B81B 7/02 (2006.01); H04R 1/22 (2006.01); H04R 1/28 (2006.01); H04R 19/04 (2006.01)
CPC H04R 1/04 (2013.01) [B81B 7/02 (2013.01); H04R 1/222 (2013.01); H04R 1/2896 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A microphone assembly comprising:
a substrate that defines a first port that extends completely therethrough;
a printed circuit board (PCB) defining a first cavity that is embedded within the PCB; the first port of the substrate being aligned with the first cavity about an axis that extends through the first port and the first cavity;
a micro-electro-mechanical systems (MEMS) transducer positioned on a first side of the substrate and being positioned directly above the first port and the first cavity;
a first lid defining a second port and covering the MEMS transducer and the first port, and the first port being axially displaced from the second port, the first lid and the substrate define a front volume of air that surrounds the MEMS transducer; and
wherein the first cavity of the PCB, and the first port of substrate define a back volume of air that is greater than the front volume of air to increase a signal-to-noise-ratio (SNR) and to increase an overall frequency response for the microphone assembly.