US 12,219,231 B2
Large image sensor package
Michael Graae, Brooklyn, NY (US); Deanan Dasilva, Malibu, CA (US); Jason Daughenbaugh, Bozeman, MT (US); Bryan Robertus, Bozeman, MT (US); Jason Kay, Bozeman, MT (US); Logan Mcdermot, Marshall, WI (US); Wayne Hansen, Lodi, WI (US); and Timothy J. Bierman, Windsor, WI (US)
Assigned to Sphere Entertainment Group, LLC, New York, NY (US)
Filed by Sphere Entertainment Group, LLC, New York, NY (US)
Filed on Aug. 12, 2022, as Appl. No. 17/887,309.
Prior Publication US 2024/0056666 A1, Feb. 15, 2024
Int. Cl. H04N 23/55 (2023.01); H01R 13/6584 (2011.01); H04N 23/57 (2023.01)
CPC H04N 23/55 (2023.01) [H01R 13/6584 (2013.01); H04N 23/57 (2023.01); H01R 2201/18 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An image sensor package, comprising:
a printed circuit board having a first face and a second face;
an image sensor electrically coupled to the printed circuit board via a plurality of wire bonds that electrically connect the image sensor to a plurality of mating pads positioned on the first face of the printed circuit board, the image sensor being surrounded by the printed circuit board in such a manner that the image sensor is separated from abutting the printed circuit board by a gap;
a sealing configuration coupled to the first face of the printed circuit board via a first gasket, the sealing configuration having a cover attached to a frame that surrounds a perimeter of the image sensor, the first gasket enabling the sealing configuration to be movable while abutting the first face of the printed circuit board as the sealing configuration expands or contracts;
a base coupled to the second face of the printed circuit board via a second gasket, the base coupling the image sensor to the printed circuit board, the second gasket enabling the base to be movable while abutting the second face of the printed circuit board as the base expands or contracts; and
a plurality of electronic components embedded on the second face of the printed circuit board, the plurality of electronic components aligning with the plurality of mating pads on the first face of the printed circuit board.