US 12,218,647 B2
Microelectromechanical resonator
Joseph C. Doll, Mountain View, CA (US); Nicholas Miller, Sunnyvale, CA (US); Charles I. Grosjean, Los Gatos, CA (US); Paul M. Hagelin, Saratoga, CA (US); and Ginel C. Hill, Sunnyvale, CA (US)
Assigned to SiTime Corporation, Santa Clara, CA (US)
Filed by SiTime Coporation, Santa Clara, CA (US)
Filed on Jan. 15, 2024, as Appl. No. 18/412,732.
Application 17/847,438 is a division of application No. 17/544,120, filed on Dec. 7, 2021, granted, now 11,677,379, issued on Jun. 13, 2023.
Application 17/544,120 is a division of application No. 16/245,184, filed on Jan. 10, 2019, granted, now 11,228,298, issued on Jan. 18, 2022.
Application 16/245,184 is a division of application No. 15/497,146, filed on Apr. 25, 2017, granted, now 10,218,333, issued on Feb. 26, 2019.
Application 15/497,146 is a division of application No. 15/186,510, filed on Jun. 19, 2016, granted, now 9,712,128, issued on Jul. 18, 2017.
Application 18/412,732 is a continuation of application No. 17/847,438, filed on Jun. 23, 2022, granted, now 11,916,534.
Application 15/186,510 is a continuation in part of application No. 14/617,753, filed on Feb. 9, 2015, granted, now 9,705,470, issued on Jul. 11, 2017.
Claims priority of provisional application 62/183,689, filed on Jun. 23, 2015.
Claims priority of provisional application 62/181,767, filed on Jun. 19, 2015.
Claims priority of provisional application 61/937,601, filed on Feb. 9, 2014.
Prior Publication US 2025/0007492 A1, Jan. 2, 2025
Int. Cl. H03H 9/125 (2006.01); H03H 3/007 (2006.01); H03H 3/02 (2006.01); H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/15 (2006.01); H03H 9/17 (2006.01); H03H 9/24 (2006.01)
CPC H03H 9/125 (2013.01) [H03H 3/0077 (2013.01); H03H 9/02259 (2013.01); H03H 9/02401 (2013.01); H03H 9/02448 (2013.01); H03H 9/1057 (2013.01); H03H 9/17 (2013.01); H03H 9/2463 (2013.01); H03H 2003/027 (2013.01); H03H 2009/02181 (2013.01); H03H 2009/02307 (2013.01); H03H 2009/155 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
receiving an integrated circuit device having a microelectromechanical systems (MEMS) structure, a storage device, a heating element and circuitry, the MEMS structure characterized by a temperature-dependent behavior, the circuitry being adapted to generate an electronic signal dependent on movement or deflection of the MEMS structure during run-time of the integrated circuit device;
as part of a calibration operation for the integrated circuit device, causing the heating element to heat the structure to a plurality of different temperatures and, for each of the different temperatures in the plurality, identifying deviation of a property conveyed the electronic signal from a desired value;
calculating a correction polynomial dependent on the identified deviations; and
programming into the storage device parameters which define the correction polynomial, such that the integrated circuit device thereby stores the correction polynomial, for application during run-time of the integrated circuit device, to electronically correct the electronic signal, within an operating temperature range of the integrated circuit device.