US 12,218,479 B2
Photonic integrated circuits with controlled collapse chip connections
SeungJae Lee, Pasadena, CA (US); Brett Sawyer, Pasadena, CA (US); Chia-Te Chou, Brea, CA (US); Jerry Byrd, Shadow Hills, CA (US); and Hooman Abediasl, Thousand Oaks, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Jul. 19, 2021, as Appl. No. 17/379,759.
Claims priority of provisional application 63/053,841, filed on Jul. 20, 2020.
Prior Publication US 2022/0021179 A1, Jan. 20, 2022
Int. Cl. H01S 5/0225 (2021.01); H01S 5/02 (2006.01); H01S 5/0239 (2021.01)
CPC H01S 5/0225 (2021.01) [H01S 5/021 (2013.01); H01S 5/0239 (2021.01)] 8 Claims
OG exemplary drawing
 
1. An optical device, comprising:
a first substrate defining:
a surface; and
a trench forming a depression along a portion of the surface;
a second substrate coupled with the surface and extending from the surface to form a raised portion around the trench;
a laser die positioned within the trench, such that the laser die is surrounded by the second substrate;
an optical material positioned within a region between the laser die, the first substrate, and the second substrate, the optical material comprising at least one of a liquid material or a solid material; and
a third substrate coupled with the second substrate such that the second substrate is positioned between the first substrate and the third substrate; wherein:
the second substrate is configured to at least partially isolate the laser die from mechanical stress exerted on the optical device.