US 12,218,469 B2
Crimping terminal
Naoki Ito, Shizuoka (JP); Kazuma Watanabe, Shizuoka (JP); and Michihiro Mori, Shizuoka (JP)
Assigned to YAZAKI CORPORATION, Tokyo (JP)
Filed by Yazaki Corporation, Tokyo (JP)
Filed on Jul. 6, 2022, as Appl. No. 17/858,136.
Claims priority of application No. 2021-112472 (JP), filed on Jul. 7, 2021.
Prior Publication US 2023/0008910 A1, Jan. 12, 2023
Int. Cl. H01R 4/00 (2006.01); H01R 4/18 (2006.01); H01R 4/26 (2006.01); H01R 11/11 (2006.01)
CPC H01R 4/185 (2013.01) [H01R 4/26 (2013.01); H01R 11/11 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A crimping terminal comprising:
a conductor crimping portion that includes: a bottom plate on which a conductor of an electric wire is disposed; and a pair of conductor tightening pieces extending from both side edges of the bottom plate in a direction intersecting an extending direction of the conductor, the conductor crimping portion configured to be crimped and connected to the conductor of the electric wire by tightening the conductor disposed on the bottom plate in a state where the conductor is covered with the conductor tightening pieces, wherein
the conductor crimping portion includes a serration formed on a surface of the conductor crimping portion on a side in contact with the conductor, the serration extending in a groove shape across the pair of conductor tightening pieces and the bottom plate in a direction intersecting the extending direction of the conductor to be disposed on the bottom plate, and
the serration is designed, in a flat plate-like developed state of the conductor crimping portion before being crimped to the conductor, such that a width of an opening of the serration in the extending direction is equal to or larger than a width of a bottom surface of the serration in the extending direction, and an angle of a side surface with respect to a normal of the bottom surface at a position of at least a part of a portion located in the conductor tightening piece is larger than an angle of the side surface with respect to the normal of the bottom surface at a portion located in the bottom plate.