US 12,218,458 B2
High-voltage electrical insulation for use in active implantable medical devices circuit board connectors
Thomas Marzano, East Amherst, NY (US); Keith W. Seitz, Clarence Center, NY (US); Christine A. Frysz, Orchard Park, NY (US); and Robert A. Stevenson, Canyon Country, CA (US)
Assigned to Greatbatch Ltd., Clarence, NY (US)
Filed by Greatbatch Ltd., Clarence, NY (US)
Filed on Oct. 4, 2023, as Appl. No. 18/376,687.
Application 18/376,687 is a continuation in part of application No. 17/561,048, filed on Dec. 23, 2021.
Application 17/561,048 is a continuation of application No. 16/809,676, filed on Mar. 5, 2020, granted, now 11,211,741, issued on Dec. 28, 2021.
Claims priority of provisional application 63/414,102, filed on Oct. 7, 2022.
Prior Publication US 2024/0039206 A1, Feb. 1, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01R 13/52 (2006.01); A61N 1/375 (2006.01); H01G 4/35 (2006.01); H01R 13/426 (2006.01); H01R 13/719 (2011.01)
CPC H01R 13/5224 (2013.01) [A61N 1/3754 (2013.01); H01G 4/35 (2013.01); H01R 13/426 (2013.01); H01R 13/521 (2013.01); H01R 13/719 (2013.01); Y10T 29/49204 (2015.01)] 28 Claims
OG exemplary drawing
 
1. A circuit board connector assembly, comprising:
a) a circuit board comprising at least a first electrical circuit;
b) a first terminal pin connector, comprising:
i) a first connector housing comprising an electrically conductive first sidewall having a first connector housing sidewall interior surface spaced from an exterior surface, the first connector housing sidewall interior surface defining a first housing opening extending along a first longitudinal axis, wherein the first connector housing exterior surface has at least one first planar exterior surface that is electrically connected to the first electrical circuit of the circuit board; and
ii) an electrically conductive first compliant structure supported by the first connector housing sidewall interior surface; and
c) an insulative material coating at least a portion of the first connector housing sidewall exterior surface, wherein the insulative material does not coat the at least one first planar exterior surface that is electrically connected to the at least one electrical circuit of the circuit board.