CPC H01Q 5/50 (2015.01) [H01Q 5/328 (2015.01); H01Q 5/335 (2015.01)] | 15 Claims |
1. An electronic device comprising:
a housing including a conductive member in which at least one feeding point and a ground point are located;
at least one ground member disposed inside the housing;
a first ground path connecting the ground point and the at least one ground member;
a second ground path connecting the ground point and the at least one ground member;
a printed circuit board (PCB) disposed inside the housing and comprising a first layer and a second layer different from the first layer; and
a processor disposed on the PCB,
wherein the processor is configured to feed the at least one feeding point such that the conductive member transmits and/or receives a signal of a first frequency band,
wherein the first ground path is formed at the first layer, and
wherein the second ground path is formed at the second layer.
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