| CPC H01Q 1/38 (2013.01) [H01Q 1/2208 (2013.01); H01Q 1/40 (2013.01)] | 18 Claims |
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18. A micro-module, comprising:
a module substrate having a module substrate surface;
an antenna disposed on the module substrate surface, the antenna extending along the module substrate surface in a direction parallel to the module substrate surface and extending away from the module substrate surface in a direction perpendicular to the module substrate surface to an antenna top surface thereby defining antenna walls;
a sealant disposed on the module substrate surface and on at least a portion of the antenna walls extending away from the module substrate to a sealant top surface, wherein the antenna walls and sealant define an enclosed area of the module substrate surface surrounded by the antenna walls and the sealant;
a module circuit disposed on or in the module substrate in the enclosed area and electrically connected to the antenna and responsive to electrical signals received from the antenna; and
a cap disposed on the antenna top surface and the sealant top surface such that the module circuit is encapsulated,
wherein the antenna forms a spiral on the module substrate and the sealant, the antenna walls, the cap, and the module substrate define multiple separately enclosed volumes along the length of the spiral.
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