US 12,218,410 B2
Electronic device including high-frequency transmission circuit
Han-Min Cho, Gyeonggi-do (KR); Chan-Gi Park, Gyeonggi-do (KR); Yeon-Sang Yun, Gyeonggi-do (KR); Tae-Wook Ham, Gyeonggi-do (KR); Hei-Seong Kwak, Gyeonggi-do (KR); Byoung-Il Son, Gyeonggi-do (KR); and Sung-Chul Park, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Sep. 1, 2023, as Appl. No. 18/459,597.
Application 18/459,597 is a continuation of application No. 18/090,214, filed on Dec. 28, 2022, granted, now 11,749,880.
Application 18/090,214 is a continuation of application No. 17/225,509, filed on Apr. 8, 2021, granted, now 11,569,565, issued on Jan. 31, 2023.
Application 17/225,509 is a continuation of application No. 16/939,708, filed on Jul. 27, 2020, granted, now 10,978,789, issued on Apr. 13, 2021.
Application 16/939,708 is a continuation of application No. 15/621,687, filed on Jun. 13, 2017, granted, now 10,727,568, issued on Jul. 28, 2020.
Claims priority of application No. 10-2016-0073355 (KR), filed on Jun. 13, 2016.
Prior Publication US 2023/0411832 A1, Dec. 21, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/02 (2006.01); H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 5/35 (2015.01); H01Q 21/28 (2006.01); H01R 12/79 (2011.01); H01R 13/66 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 7/14 (2006.01)
CPC H01Q 1/243 (2013.01) [H01Q 1/38 (2013.01); H01Q 5/35 (2015.01); H01Q 21/28 (2013.01); H01R 12/79 (2013.01); H01R 13/6691 (2013.01); H05K 1/0218 (2013.01); H05K 1/0243 (2013.01); H05K 1/028 (2013.01); H05K 1/115 (2013.01); H05K 1/142 (2013.01); H05K 1/148 (2013.01); H05K 1/18 (2013.01); H05K 7/1427 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/0999 (2013.01); H05K 2201/10098 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A portable communication device, comprising:
a housing;
a first printed circuit board (PCB) accommodated in the housing;
a wireless communication circuitry disposed on the first PCB; and
a second PCB having a plurality of layers including:
a first PCB portion;
a second PCB portion continuously extended from the first PCB portion and more flexible than the first PCB portion;
a third PCB portion continuously extended from the second PCB portion and less flexible than the second PCB portion;
a fourth PCB portion continuously extended from the third PCB portion and more flexible than the third PCB portion; and
a plurality of lines formed at a same layer of the plurality of layers as continuously extended from the second PCB portion through the third PCB portion to the fourth PCB portion, the plurality of lines including a first ground line and a second ground line spaced apart from each other, and a first signal line located between the first ground line and the second ground line.