US 12,218,408 B2
Antenna boards and communication devices
Trang Thai, Hillsboro, OR (US); Sidharth Dalmia, Portland, OR (US); Raanan Sover, Haifa (IL); Josef Hagn, Taufkirchena (DE); Omer Asaf, Oranit M (IL); and Simon Svendsen, Aalborg (DK)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Apr. 15, 2021, as Appl. No. 17/231,051.
Application 17/231,051 is a continuation of application No. 15/977,612, filed on May 11, 2018, granted, now 11,011,827, issued on May 18, 2021.
Prior Publication US 2021/0234260 A1, Jul. 29, 2021
Int. Cl. H01Q 1/24 (2006.01); H01L 23/64 (2006.01); H01L 23/66 (2006.01); H01Q 9/04 (2006.01); H01Q 21/06 (2006.01)
CPC H01Q 1/243 (2013.01) [H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01Q 9/0407 (2013.01); H01Q 9/0414 (2013.01); H01Q 21/065 (2013.01)] 37 Claims
OG exemplary drawing
 
1. An antenna module, comprising:
an antenna board and a die coupled to the antenna board, wherein the antenna board includes:
a ground plane;
an antenna feed structure;
a stack of antenna patches parallel to the ground plane;
a conductive ring around a first antenna patch of the stack of antenna patches, wherein the first antenna patch is an antenna patch that is closer to the antenna feed structure than all other antenna patches of the stack of antenna patches; and
conductive posts around the antenna feed structure, wherein the conductive posts are in conductive contact with the ground plane and with the conductive ring,
wherein the first antenna patch is an only antenna patch surrounded by the conductive ring, and no portion of the antenna feed structure is in conductive contact with the first antenna patch.