US 12,218,295 B2
Micro LED display and manufacturing method therefor
Byunghoon Lee, Suwon-si (KR); Taeil Kim, Suwon-si (KR); Jamyeong Koo, Suwon-si (KR); and Juseung Lee, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR); and Research & Business Foundation Sungkyunkwan University, Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR); and RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY, Suwon-si (KR)
Filed on Nov. 29, 2021, as Appl. No. 17/456,838.
Application 17/456,838 is a continuation of application No. PCT/KR2020/006796, filed on May 26, 2020.
Claims priority of application No. 10-2019-0063285 (KR), filed on May 29, 2019.
Prior Publication US 2022/0085265 A1, Mar. 17, 2022
Int. Cl. H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01)
CPC H01L 33/62 (2013.01) [H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/167 (2013.01); H01L 24/04 (2013.01); H01L 24/08 (2013.01); H01L 24/92 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05609 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/08148 (2013.01); H01L 2224/29201 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/32146 (2013.01); H01L 2224/8034 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83874 (2013.01); H01L 2224/83906 (2013.01); H01L 2224/92142 (2013.01); H01L 2224/9221 (2013.01); H01L 2933/0066 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method for manufacturing a micro Light Emitting Diode (LED) display, the method comprising:
coating a face of a substrate including a circuit portion with a first thickness of a polymer adhesive solution containing a plurality of metal particles;
attaching an array of micro LED chips on the polymer adhesive solution;
forming a space between a connection pad for each of the array of micro LED chips and the plurality of metal particles through heating and pressing applied to the polymer adhesive solution;
physically connecting the connection pad for each of the array of micro LED chips to the metal particles by the heating and the pressing the attached array of micro LED chips to descend through the polymer adhesive solution; and
chemically bonding the metal particles to the connection pad and the circuit portion by the heating and the pressing so that the micro LED chips are electrically connected to the circuit portion,
wherein the chemically bonding comprises forming an alloy formed by bonding of a portion of the plurality of metal particles with the circuit portion.