US 12,218,293 B2
Pixel module employing molding member having multi-molding layer and displaying apparatus having the same
Junhong Min, Gyeonggi-do (KR); and Ik Kyu You, Gyeonggi-do (KR)
Assigned to SEOUL VIOSYS CO., LTD., Ansan-si (KR)
Filed by SEOUL VIOSYS CO., LTD., Gyeonggi-do (KR)
Filed on Feb. 7, 2022, as Appl. No. 17/666,202.
Claims priority of provisional application 63/150,806, filed on Feb. 18, 2021.
Prior Publication US 2022/0262993 A1, Aug. 18, 2022
Int. Cl. H01L 33/58 (2010.01); H01L 25/075 (2006.01)
CPC H01L 33/58 (2013.01) [H01L 25/0753 (2013.01); H01L 2933/0058 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A pixel module, comprising:
a circuit board;
unit pixels arranged on the circuit board; and
a molding layer covering the unit pixels,
wherein the molding layer includes a light diffusion layer and a black molding layer covering the light diffusion layer such that the molding layer is disposed between the unit pixels, and
wherein the light diffusion layer comprises a first region having a first thickness and disposed between the unit pixels and the black molding layer comprises a second region having a second thickness and disposed on the light diffusion layer, the second thickness being smaller than the first thickness, and
wherein a maximum value of Δu′v′ that is indicative of color deviation of the pixel module and in a range of +−45 degree is equal to or less than 0.01.