US 12,218,287 B2
Electronic package
Olivier Zanellato, Chambery (FR); Remi Brechignac, Grenoble (FR); and Jerome Lopez, Saint Jean de Moirans (FR)
Assigned to STMICROELECTRONICS (GRENOBLE 2) SAS, Grenoble (FR)
Filed by STMICROELECTRONICS (GRENOBLE 2) SAS, Grenoble (FR)
Filed on Nov. 6, 2023, as Appl. No. 18/503,025.
Application 18/503,025 is a continuation of application No. 17/485,010, filed on Sep. 24, 2021, granted, now 11,862,757.
Claims priority of application No. 2009984 (FR), filed on Sep. 30, 2020.
Prior Publication US 2024/0072214 A1, Feb. 29, 2024
Int. Cl. H01L 33/48 (2010.01); H01L 31/0203 (2014.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01)
CPC H01L 33/483 (2013.01) [H01L 31/0203 (2013.01); H01L 31/18 (2013.01); H01L 33/005 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
a support including a first side and a second side opposite to the first side;
a wall on the first side of the support, the wall including one or more inner sidewalls, one or more outer sidewalls opposite to the one or more inner sidewalls, a first surface that faces away from the support and extends from the one or more inner sidewalls to the one or more outer sidewalls, and a cavity defined by the one or more inner sidewalls, the wall further includes a first corner portion, a second corner portion spaced apart from the first corner portion, and an intermediate portion that is between the first corner portion and the second corner portion and extends from the first corner portion to the second corner portion;
an electronic device within the cavity, the electronic device including one or more sidewalls;
a gap extends from the one or more inner sidewalls of the wall to the one or more sidewalls of the electronic device, and the gap separates the one or more inner sidewalls of the wall from the one or more sidewalls of the electronic device;
a bonding layer on the first surface of the wall;
a plate coupled to the bonding layer, the plate extends fully across the cavity, the plate having a second surface coupled to the bonding layer; and
a degradable material within the bonding layer, the degradable material extends from the first surface of the wall to the second surface of the plate, and the degradable material extends from a respective outer sidewall of the one or more outer sidewalls to a respective inner sidewall of the one or more inner sidewalls, and
wherein the respective inner sidewall extends from the first corner portion to the second corner portion, the respective outer sidewall extends from the first corner portion to the second corner portion, and the degradable material within the bonding layer is at and along the intermediate portion of the wall.