US 12,218,286 B2
Light emitting module and method of manufacturing the same and display apparatus having the same
Jae Hyun Park, Ansan-si (KR); and Seung Sik Hong, Ansan-si (KR)
Assigned to Seoul Semiconductor Co., Ltd., Ansan-si (KR)
Filed by Seoul Semiconductor Co., Ltd., Ansan-si (KR)
Filed on Nov. 11, 2021, as Appl. No. 17/524,607.
Claims priority of provisional application 63/247,762, filed on Sep. 23, 2021.
Claims priority of provisional application 63/112,778, filed on Nov. 12, 2020.
Prior Publication US 2022/0149246 A1, May 12, 2022
Int. Cl. H01L 33/48 (2010.01); G02B 1/11 (2015.01); H01L 25/075 (2006.01); H01L 33/58 (2010.01)
CPC H01L 33/483 (2013.01) [H01L 25/0753 (2013.01); H01L 33/58 (2013.01); G02B 1/11 (2013.01); H01L 2933/0058 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A light emitting module, comprising:
a circuit board;
a plurality of unit pixels arranged on the circuit board;
a molding layer covering the unit pixels; and
an anti-glare layer disposed on the molding layer,
wherein the molding layer includes a first molding layer at least partially covering each of the unit pixels, and a second molding layer covering the first molding layer, and
wherein the first molding layer located on a side surface of at least one of the plurality of unit pixels forms a sidewall including a region that increases in thickness along the side surface from an upper portion toward a lower portion of the at least one of the plurality of unit pixels.