1. A micro light-emitting diode (μLED) chip, comprising: a first electrode layer; a second semiconductor layer located on a surface of the first electrode layer, the second semiconductor layer being electrically connected to the first electrode layer, and being configured to transmit first carriers; a first semiconductor layer located on a side of the second semiconductor layer away from the first electrode layer, the first semiconductor layer being configured to transmit second carriers; and a light-emitting layer located between the first semiconductor layer and the second semiconductor layer, the light-emitting layer being configured to be excited to emit light upon combination of the first carriers and the second carriers, wherein a surface of the first semiconductor layer away from the light-emitting layer is a concave-convex microstructure, and convex portions of the concave-convex microstructure are configured to receive an electron beam.