US 12,218,169 B2
Semiconductor device and solid-state image sensor including pixel substrate joined with another substrate
Yosuke Nitta, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/436,985
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Jan. 7, 2020, PCT No. PCT/JP2020/000118
§ 371(c)(1), (2) Date Sep. 7, 2021,
PCT Pub. No. WO2020/194981, PCT Pub. Date Oct. 1, 2020.
Claims priority of application No. 2019-054998 (JP), filed on Mar. 22, 2019.
Prior Publication US 2022/0181377 A1, Jun. 9, 2022
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14636 (2013.01) [H01L 27/14685 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a first substrate including a first semiconductor circuit, wherein
the first semiconductor circuit includes a first terminal, and
the first substrate is individualized into a first chip; and
a second substrate including a second semiconductor circuit, wherein
the second semiconductor circuit includes a second terminal,
the first terminal is joined to the second terminal,
the second substrate further includes:
a first insulating layer between the second substrate and the first substrate; and
a second insulating layer between the first insulating layer and the first substrate,
the second terminal is in the second insulating layer,
the second terminal is between the first insulating layer and the first terminal, and
the second terminal faces the second substrate.