US 12,218,148 B2
Display module having glass substrate formed with side wirings and method for manufacturing same
Jeongyun Kim, Suwon-si (KR); Hosuk Kang, Suwon-si (KR); Jinwoo Jung, Suwon-si (KR); Changjoon Lee, Suwon-si (KR); Tackmo Lee, Suwon-si (KR); Gyun Heo, Suwon-si (KR); and Soonmin Hong, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Oct. 27, 2021, as Appl. No. 17/512,126.
Application 17/512,126 is a continuation of application No. PCT/KR2021/005551, filed on May 3, 2021.
Claims priority of application No. 10-2020-0054878 (KR), filed on May 8, 2020; and application No. 10-2021-0028573 (KR), filed on Mar. 4, 2021.
Prior Publication US 2022/0052080 A1, Feb. 17, 2022
Int. Cl. H01L 27/12 (2006.01); H01L 25/16 (2023.01)
CPC H01L 27/124 (2013.01) [H01L 25/167 (2013.01); H01L 27/1262 (2013.01); H01L 27/1218 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A display module comprising:
a glass substrate;
a thin film transistor (TFT) layer provided on a front surface of the glass substrate;
a driving circuit provided on a rear surface of the glass substrate, the driving circuit being configured to drive the TFT layer;
a plurality of light emitting diodes (LED) electrically connected to the TFT layer;
a plurality of first connection pads provided at intervals in a portion of the front surface of the glass substrate that is adjacent to a lateral surface of the glass substrate, the plurality of first connection pads being electrically connected to a TFT circuit provided in the TFT layer through a plurality of first wirings;
a plurality of second connection pads provided at intervals in a portion of the rear surface of the glass substrate adjacent to the lateral surface of the glass substrate, the plurality of second connection pads being electrically connected to the driving circuit through a plurality of second wirings; and
a plurality of side wirings extending from the lateral surface of the glass substrate to a portion of an insulating layer by passing the first connection pads and extending to another portion of the insulating layer by passing the second connection pads,
wherein the first connection pads have an uneven portion.