US 12,218,117 B2
Method of forming package structure and package structure therefrom
Chih-Chien Pan, Taipei (TW); Chin-Fu Kao, Taipei (TW); Li-Hui Cheng, New Taipei (TW); and Szu-Wei Lu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Nov. 13, 2023, as Appl. No. 18/508,165.
Application 17/717,110 is a division of application No. 16/836,927, filed on Apr. 1, 2020, granted, now 11,302,683, issued on Apr. 12, 2022.
Application 18/508,165 is a continuation of application No. 17/717,110, filed on Apr. 10, 2022, granted, now 11,855,054.
Prior Publication US 2024/0079399 A1, Mar. 7, 2024
Int. Cl. H01L 25/16 (2023.01); G02B 6/13 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/24 (2006.01)
CPC H01L 25/167 (2013.01) [G02B 6/13 (2013.01); H01L 21/561 (2013.01); H01L 23/24 (2013.01); H01L 24/16 (2013.01); H01L 2224/16145 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a package structure, comprising:
providing a semiconductor structure having a photonic element region;
electrically bonding a semiconductor die to the semiconductor structure;
forming a polymeric wall structure on the semiconductor structure and laterally aside the semiconductor die, wherein the polymeric wall structure is ring-shaped with a through hole defined by inner sidewalls of the polymeric wall structure, and the through hole exposes the photonic element region of the semiconductor structure;
forming a filling material to fill the through hole within the wall structure;
forming an encapsulant laterally wrapping around the semiconductor die, the polymeric wall structure and the filling material; and
removing the filling material to reveal the through hole.