	US 12,218,110 B2
	Red flip chip light emitting diode, package, and method of making the same
Vladimir A. Odnoblyudov, Danville, CA (US)
Assigned to Bridgelux, Inc., Livermore, CA (US)
Filed by Bridgelux, Inc., Livermore, CA (US)
Filed on Nov. 14, 2022, as Appl. No. 17/986,805.
Application 15/986,748 is a division of application No. 14/752,803, filed on Jun. 26, 2015, granted, now 9,978,724, issued on May 22, 2018.
Application 17/986,805 is a continuation of application No. 16/667,540, filed on Oct. 29, 2019, granted, now 11,502,066.
Application 16/667,540 is a continuation of application No. 15/986,748, filed on May 22, 2018, granted, now 10,461,064, issued on Oct. 29, 2019.
Claims priority of provisional application 62/018,511, filed on Jun. 27, 2014.
Prior Publication US 2023/0178525 A1, Jun. 8, 2023
Int. Cl. H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01); H01L 33/56 (2010.01)

CPC H01L 25/0753 (2013.01) [H01L 33/501 (2013.01); H01L 33/502 (2013.01); H01L 33/504 (2013.01); H01L 33/508 (2013.01); H01L 33/52 (2013.01); H01L 33/56 (2013.01); H01L 33/0093 (2020.05); H01L 33/50 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/181 (2013.01)]

10 Claims

1. A flip chip light emitting diode comprising:

an active material layer having a first surface bonded to a transparent carrier, the active material layer comprising a first region and a second region, the first region being at a depth of the active material layer different than the second region;

first and second electrical terminals extending from a second surface of the active material layer opposite the first surface, the first electrical terminal in contact with the first region, and the second electrical terminal in contact with the second region; and

an insulating material interposed between the first electrical terminal and the second region, wherein the second electrical terminal is free from an entirety of the insulating material and from contacting any insulating material of the flip chip light emitting diode.