US 12,218,108 B2
Package and manufacturing method thereof
Hsien-Wei Chen, Hsinchu (TW); Jie Chen, New Taipei (TW); and Ming-Fa Chen, Taichung (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Feb. 26, 2024, as Appl. No. 18/586,549.
Application 18/586,549 is a continuation of application No. 17/739,198, filed on May 9, 2022, granted, now 11,942,454.
Application 17/739,198 is a continuation of application No. 16/801,156, filed on Feb. 26, 2020, granted, now 11,362,065, issued on Jun. 14, 2022.
Prior Publication US 2024/0203947 A1, Jun. 20, 2024
Int. Cl. H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 25/00 (2006.01); H01L 49/02 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/528 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/89 (2013.01); H01L 25/50 (2013.01); H01L 28/60 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/80001 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/19041 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package, comprising:
a first die comprising a first capacitor;
a second die comprising a second capacitor, wherein the second die is stacked on the first die, the first capacitor is spatially separated from the second capacitor, and the first capacitor is electrically connected to the second capacitor; and
an encapsulant laterally encapsulating the second die.