US 12,218,103 B2
Radiation hardened semiconductor devices and packaging
Chong Leong Gan, Taichung (TW)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on May 26, 2022, as Appl. No. 17/825,695.
Prior Publication US 2023/0387079 A1, Nov. 30, 2023
Int. Cl. H01L 25/065 (2023.01); H01L 25/00 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 25/50 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device assembly comprising:
a substrate;
a semiconductor die stack electrically coupled to the substrate;
an ionizing radiation shield disposed over a top die of the semiconductor die stack, wherein the ionizing radiation shield comprises silicon carbide (SiC); and
an encapsulant at least partially encapsulating the semiconductor die stack and the ionizing radiation shield.