CPC H01L 24/80 (2013.01) [H01L 21/304 (2013.01); H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/544 (2013.01); H01L 24/08 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68372 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/0217 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80139 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06593 (2013.01)] | 20 Claims |
1. A method comprising:
placing a first package component, wherein the first package component comprises:
a first alignment mark; and
a first dummy alignment mark, wherein both of the first alignment mark and the first dummy alignment mark are electrically floating;
aligning a second package component to the first package component, wherein the second package component comprises:
a second alignment mark; and
a second dummy alignment mark, wherein both of the second alignment mark and the second dummy alignment mark are electrically floating, wherein the aligning comprises searching for a first pattern of the first alignment mark for positioning the first package component, and the aligning is performed ignoring a second pattern of the first dummy alignment mark; and
bonding the second package component to the first package component to form a package, wherein after the bonding, the first alignment mark is bonded to the second dummy alignment mark.
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