US 12,218,097 B2
Bonding to alignment marks with dummy alignment marks
Hsien-Wei Chen, Hsinchu (TW); Ying-Ju Chen, Tuku Township (TW); and Ming-Fa Chen, Taichung (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Aug. 2, 2023, as Appl. No. 18/364,310.
Application 18/364,310 is a continuation of application No. 17/325,667, filed on May 20, 2021, granted, now 11,862,599.
Claims priority of provisional application 63/166,353, filed on Mar. 26, 2021.
Prior Publication US 2023/0378122 A1, Nov. 23, 2023
Int. Cl. H01L 23/544 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/80 (2013.01) [H01L 21/304 (2013.01); H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/544 (2013.01); H01L 24/08 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68372 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/0217 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80139 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06593 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
placing a first package component, wherein the first package component comprises:
a first alignment mark; and
a first dummy alignment mark, wherein both of the first alignment mark and the first dummy alignment mark are electrically floating;
aligning a second package component to the first package component, wherein the second package component comprises:
a second alignment mark; and
a second dummy alignment mark, wherein both of the second alignment mark and the second dummy alignment mark are electrically floating, wherein the aligning comprises searching for a first pattern of the first alignment mark for positioning the first package component, and the aligning is performed ignoring a second pattern of the first dummy alignment mark; and
bonding the second package component to the first package component to form a package, wherein after the bonding, the first alignment mark is bonded to the second dummy alignment mark.