	US 12,218,091 B2
	Superconducting bump bonds for quantum computing systems
Zhimin Jamie Yao, Santa Barbara, CA (US); and Bob Benjamin Buckley, Santa Barbara, CA (US)
Assigned to GOOGLE LLC, Mountain View, CA (US)
Filed by Google LLC, Mountain View, CA (US)
Filed on Mar. 3, 2023, as Appl. No. 18/177,876.
Application 18/177,876 is a division of application No. 17/163,232, filed on Jan. 29, 2021, granted, now 11,600,588.
Prior Publication US 2023/0207507 A1, Jun. 29, 2023
Int. Cl. H01L 23/00 (2006.01); G06N 10/00 (2022.01); H01L 25/16 (2023.01)

CPC H01L 24/13 (2013.01) [G06N 10/00 (2019.01); H01L 24/81 (2013.01); H01L 25/16 (2013.01); H01L 2224/13105 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13117 (2013.01); H01L 2224/1312 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13179 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13666 (2013.01); H01L 2224/8112 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01031 (2013.01); H01L 2924/01041 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01048 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01083 (2013.01); H01L 2924/04941 (2013.01)]

16 Claims

1. A method for bonding substrates, the method comprising:

depositing, on a first substrate, one or more tin bond deposits, the one or more tin bond deposits comprising tin;

heating the first substrate to a tin contact bond formation temperature; and

pressing the first substrate against a second substrate to form one or more tin contact bonds from the one or more tin bond deposits;

wherein one of the first substrate or the second substrate comprises one or more qubits and another of the first substrate or the second substrate comprises one or more control devices configured to control the one or more qubits.