US 12,218,080 B2
Package structure with reinforced element
Shin-Puu Jeng, Hsinchu (TW); Po-Yao Lin, Zhudong Township, Hsinchu County (TW); Shuo-Mao Chen, New Taipei (TW); and Chia-Hsiang Lin, Zhubei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 13, 2023, as Appl. No. 18/182,728.
Application 18/182,728 is a continuation of application No. 17/071,030, filed on Oct. 15, 2020, granted, now 11,605,600.
Claims priority of provisional application 63/061,828, filed on Aug. 6, 2020.
Prior Publication US 2023/0223360 A1, Jul. 13, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/64 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/642 (2013.01); H01L 24/16 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a reinforced plate;
a plurality of conductive structures penetrating through the reinforced plate;
a redistribution structure over the reinforced plate, wherein the redistribution structure comprises a plurality of polymer-containing layers and a plurality of conductive features, the reinforced plate is thinner than the redistribution structure, and a thickness ratio of a thickness of the reinforced plate to a thickness of the redistribution structure is greater than about 0.5;
a plurality of chip structures bonded to the redistribution structure through a plurality of solder bumps;
an underfill structure surrounding the solder bumps, wherein a portion of the underfill structure is between the redistribution structure and the chip structures; and
a protective layer surrounding the chip structures, wherein the underfill structure separates at least one of the chip structures from the protective layer.