CPC H01L 23/562 (2013.01) [H01L 21/4853 (2013.01); H01L 23/16 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01)] | 20 Claims |
1. A method for manufacturing a semiconductor assembly, the method comprising:
fabricating a substrate by:
forming a recess in a base structure, and
positioning a reinforcement structure at least partially in the recess, wherein the reinforcement structure has a higher stiffness than the base structure; and
mounting a semiconductor die onto the substrate such that the semiconductor die is positioned at least partially over the reinforcement structure.
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