US 12,218,077 B2
Semiconductor device package
Cheng-Nan Lin, Kaohsiung (TW); Ming-Chiang Lee, Kaohsiung (TW); and Yung-I Yeh, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Mar. 25, 2022, as Appl. No. 17/705,216.
Prior Publication US 2023/0307380 A1, Sep. 28, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2023.01)
CPC H01L 23/562 (2013.01) [H01L 23/5385 (2013.01); H01L 24/48 (2013.01); H01L 25/18 (2013.01); H01L 2224/48145 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor device package, comprising:
a carrier;
a first electronic component disposed on the carrier;
a support component disposed on the carrier;
a second electronic component disposed on the first electronic component and supported by the support component,
wherein the second electronic component comprises a first set of conductive pads, and the support component and at least one of the first set of conductive pads are overlapping; and
a third electronic component disposed on the second electronic component, wherein the first set of conductive pads are not covered by the third electronic component.