US 12,218,068 B2
Through electrode substrate, electronic unit, method for manufacturing through electrode substrate, and method for manufacturing electronic unit
Hiroshi Kudo, Tokyo (JP); Miyuki Suzuki, Tokyo (JP); and Shohei Yamada, Tokyo (JP)
Assigned to DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
Appl. No. 17/601,960
Filed by DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
PCT Filed Apr. 15, 2020, PCT No. PCT/JP2020/016515
§ 371(c)(1), (2) Date Oct. 7, 2021,
PCT Pub. No. WO2020/213624, PCT Pub. Date Oct. 22, 2020.
Claims priority of application No. 2019-077292 (JP), filed on Apr. 15, 2019.
Prior Publication US 2022/0148973 A1, May 12, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/12 (2006.01)
CPC H01L 23/5384 (2013.01) [H01L 21/486 (2013.01); H01L 23/12 (2013.01); H01L 23/5386 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A through electrode substrate comprising:
a substrate having a first surface, a second surface, and a through-hole that penetrates between the first surface and the second surface; and
a through electrode disposed inside of the through-hole,
wherein the through electrode includes a first portion that closes part of the through-hole adjacent to the first surface and a second portion disposed along an internal surface of the through-hole,
wherein a thinnest part of the first portion in a direction perpendicular to the first surface has a thickness of A, a thinnest part of the second portion has a thickness of B, and a diameter of the through-hole on the first surface has a length of C, and
wherein a relationship A<C<A+B×2 is satisfied.