CPC H01L 23/5223 (2013.01) [H01L 23/5226 (2013.01); H01L 27/0688 (2013.01); H03K 19/1733 (2013.01)] | 20 Claims |
1. An apparatus comprising:
a first metal layer that extends along an x-plane;
a second metal layer that extends along the x-plane, wherein the second metal layer is above the first metal layer;
a first via that extends along a y-plane, wherein the y-plane is orthogonal to the x-plane, and wherein the first via couples the first metal layer with the second metal layer;
a second via that extends along the y-plane, wherein the second via couples the second metal layer, wherein the second via is above the first via;
a first pedestal on the first metal layer, wherein the first pedestal is laterally offset from the first via;
a second pedestal on the second metal layer, wherein the second pedestal is laterally offset from the second via;
a summing node coupled to the first via;
a first input line that extends along a z-plane, wherein the z-plane is orthogonal to the x-plane and the y-plane;
a second input line that extends along the z-plane;
a first planar stack of materials including a first linear dielectric material, wherein the first planar stack of materials has a first top electrode and a first bottom electrode, wherein the first linear dielectric material is between the first top electrode and the first bottom electrode, wherein the first bottom electrode is on the first pedestal, and wherein the first input line is on the first top electrode;
a second planar stack of materials including a second linear dielectric material, wherein the second planar stack of materials has a second top electrode and a second bottom electrode, wherein the second linear dielectric material is between the second top electrode of the second planar stack of materials and the second bottom electrode and the second planar stack of materials, wherein the second bottom electrode is on the second pedestal, and wherein the second input line on the second top electrode of the second planar stack of materials; and
a pull-up device coupled to the summing node and a power supply rail.
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