US 12,218,042 B2
Via plug resistor
Santosh Gangal, Bangalore (IN); and Tin Poay Chuah, Bayan Baru (MY)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 17, 2021, as Appl. No. 17/204,587.
Prior Publication US 2022/0302006 A1, Sep. 22, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 49/02 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/42 (2006.01)
CPC H01L 23/49827 (2013.01) [H01L 21/486 (2013.01); H01L 24/16 (2013.01); H01L 28/24 (2013.01); H01L 28/60 (2013.01); H05K 1/113 (2013.01); H05K 1/162 (2013.01); H05K 1/167 (2013.01); H05K 3/423 (2013.01); H01L 28/22 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/15311 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
an electronic substrate comprising a via extending at least partially between a first side and an opposing second side of the electronic substrate, wherein a surface of the via comprises one or more layers of the electronic substrate;
a resistive element comprising a resistive material within the via, the resistive element on the surface of the via, and the resistive material comprising one or more of nickel and chromium, ruthenium and oxygen, iridium and oxygen, rhenium and oxygen, gold, tin, or a carbon nanotube epoxy; and
first and second electrodes coupled to the resistive element.