US 12,218,031 B2
Thermal interface material containment
John W. Osenbach, Kutztown, PA (US); Gannon Reichert, Bethlehem, PA (US); and Vinh Nguyen, Orefield, PA (US)
Assigned to Infinera Corporation, San Jose, CA (US)
Filed by Infinera Corp., Sunnyvale, CA (US)
Filed on Jan. 4, 2022, as Appl. No. 17/568,535.
Claims priority of provisional application 63/133,776, filed on Jan. 4, 2021.
Prior Publication US 2022/0216127 A1, Jul. 7, 2022
Int. Cl. H01L 23/433 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01)
CPC H01L 23/433 (2013.01) [H01L 21/50 (2013.01); H01L 23/3672 (2013.01); H01L 23/3733 (2013.01); H01L 23/562 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A bare circuit integrated circuit package, comprising:
a substrate connected to a printed circuit board;
an integrated circuit connected to the substrate, the integrated circuit having a top;
a stiffener ring attached to the substrate, the stiffener ring surrounding the integrated circuit;
a heat sink having a bottom surface that is positioned on the stiffener ring and over the integrated circuit such that there is a space between the top of the integrated circuit and the bottom surface of the heat sink, the heat sink connected to the printed circuit board;
a thermal interface material, the thermal interface material having an uncompressed volume and a compressed volume, the compressed volume being a volume of the thermal interface material compressed in the space between the top of the integrated circuit and the bottom surface of the heat sink to thermally connect the integrated circuit and the heat sink; and
a containment ring having a first wall and a second wall positioned between the stiffener ring and the integrated circuit, the containment ring sized and positioned such that a gap between the first wall of the containment ring and the integrated circuit has a volume of air of between zero percent and thirty percent smaller than the compressed volume of the thermal interface material.