US 12,218,030 B2
Electronic module comprising a semiconductor package with integrated clip and fastening element
Edward Fuergut, Dasing (DE); Peter Eibl, Maxhuette/Pirkensee (DE); Horst Groeninger, Maxhuette-Haidhof (DE); Martin Gruber, Schwandorf (DE); Christian Kasztelan, Penang (MY); and Philipp Seng, Munich (DE)
Assigned to Infineon Technologies Austria AG, Villach (AT)
Filed by Infineon Technologies Austria AG, Villach (AT)
Filed on Mar. 12, 2020, as Appl. No. 16/816,561.
Claims priority of application No. 19163200 (EP), filed on Mar. 15, 2019.
Prior Publication US 2020/0294885 A1, Sep. 17, 2020
Int. Cl. H01L 23/40 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 25/11 (2006.01)
CPC H01L 23/4006 (2013.01) [H01L 21/565 (2013.01); H01L 23/4093 (2013.01); H01L 23/49503 (2013.01); H01L 23/49537 (2013.01); H01L 24/83 (2013.01); H01L 25/115 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01); H01L 24/32 (2013.01); H01L 2224/32245 (2013.01)] 2 Claims
OG exemplary drawing
 
1. An electronic module, comprising:
a semiconductor package;
a clip connected to the semiconductor package, the clip comprising at least one fastening element which is configured to make a connection to an external heatsink; and
wherein the semiconductor package comprises a semiconductor die and an encapsulant of electrically insulating material that encapsulates the semiconductor die,
wherein a portion of the clip is completely embedded in the encapsulant,
wherein the clip is electrically isolated from the semiconductor die by a portion of the encapsulant, and
wherein the at least one fastening element is a curved bend in the clip that is dimensioned such that an end portion of the clip comprising the curved bend can be securely retained within a bulge of a trench in the external heatsink.