US 12,218,025 B2
Electronic device
Syuhei Miyachi, Kariya (JP)
Assigned to DENSO CORPORATION, Kariya (JP)
Filed by DENSO CORPORATION, Kariya (JP)
Filed on Mar. 23, 2022, as Appl. No. 17/656,158.
Application 17/656,158 is a continuation of application No. PCT/JP2020/036484, filed on Sep. 25, 2020.
Claims priority of application No. 2019-176914 (JP), filed on Sep. 27, 2019.
Prior Publication US 2022/0216122 A1, Jul. 7, 2022
Int. Cl. H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01); H01L 23/29 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/3735 (2013.01); H01L 25/072 (2013.01); H01L 23/295 (2013.01); H01L 23/3736 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a semiconductor device including:
a semiconductor element;
a conductive member electrically connected to the semiconductor element; and
a resin mold sealing the semiconductor element;
a wiring board including:
a wiring portion on which the semiconductor device is mounted; and
a resist portion disposed around the wiring portion;
a heat dissipating member in thermal contact with at least one of surfaces of the semiconductor device; and
a housing in thermal contact with the semiconductor device through the heat dissipating member, wherein
each of the resin mold and the heat dissipating member has a thermal conductivity higher than that of the resist portion.