US 12,218,017 B2
Glass carrier having protection structure and manufacturing method thereof
Wen Yu Lin, Taoyuan (TW); Kai-Ming Yang, Taoyuan (TW); and Pu-Ju Lin, Hsinchu (TW)
Assigned to UNIMICRON TECHNOLOGY CORP., Taoyuan (TW)
Filed by UNIMICRON TECHNOLOGY CORP., Taoyuan (TW)
Filed on Jan. 27, 2022, as Appl. No. 17/586,106.
Claims priority of application No. 110149512 (TW), filed on Dec. 30, 2021.
Prior Publication US 2023/0215772 A1, Jul. 6, 2023
Int. Cl. C03C 17/00 (2006.01); C03C 17/22 (2006.01); C03C 17/42 (2006.01); H01L 23/10 (2006.01); H01L 23/15 (2006.01); H01L 23/29 (2006.01); H05K 1/03 (2006.01)
CPC H01L 23/15 (2013.01) [C03C 17/002 (2013.01); C03C 17/225 (2013.01); C03C 17/42 (2013.01); H01L 23/10 (2013.01); H01L 23/291 (2013.01); C03C 2218/154 (2013.01); H05K 1/0306 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A glass carrier having a dual lateral surface protection structure, comprising:
a glass body, having a carrying surface, a bottom surface, and a lateral surface; wherein the carrying surface and the bottom surface are opposite, and the lateral surface connects the carrying surface and the bottom surface;
a first protection layer, fully covering the lateral surface of the glass body; and
a second protection layer, covering the first protection layer over the lateral surface of the glass body;
a circuit board structure, mounted on the carrying surface of the glass body; and
a protection shell, mounted over the circuit board structure and the glass body and exposing the dual lateral surface protection structure of the glass body;
wherein the first protection layer is a hard material with a stiffness coefficient higher than a stiffness coefficient of the glass body and the second protection layer is a soft material with a stiffness coefficient lower than the stiffness coefficient of the glass body;
wherein the first protection layer and the second protection layer are contactless with the circuit board structure.