| CPC H01L 21/6838 (2013.01) [H01L 21/677 (2013.01)] | 5 Claims |
|
1. A conveying device, comprising:
a chuck part configured to hold an object, which is a semiconductor chip or a semiconductor wafer, in a non-contact manner to face a holding surface; and
guide parts having a plurality of guide probes that are columnar and capable of abutting a side surface of the object at intervals and, for the object held by the chuck part, the guide probes limiting movement of the object in a lateral direction that intersects a direction of a normal of the holding surface,
wherein each of the guide probes is capable of performing reciprocating movement in which a tip of corresponding one of the guide probes expands and contracts with respect to the holding surface,
the guide probes comprise a first guide probe provided on a guide part and extending in a direction inclined with respect to the direction of the normal, and a second guide probe provided on another guide part and extending in a direction inclined with respect to the direction of the normal,
a separation width between a tip of the first guide probe and a tip of the second guide probe is larger than a separation width between a base end of the first guide probe and a base end of the second guide probe, and
the tip of the first guide probe and the tip of the second guide probe are rounded.
|