US 12,217,995 B2
Method of mounting conductive balls using electrostatic chuck
Youn Sung Ko, Chungcheongnam-do (KR); and Yoshiaki Yukimori, Kanagawa (JP)
Assigned to PROTEC CO., LTD., Gyeonggi-do (KR)
Filed by PROTEC CO., LTD., Gyeonggi-do (KR)
Filed on Dec. 1, 2022, as Appl. No. 18/073,493.
Application 18/073,493 is a continuation of application No. PCT/KR2021/006836, filed on Jun. 2, 2021.
Claims priority of application No. 10-2020-0066851 (KR), filed on Jun. 3, 2020.
Prior Publication US 2023/0093905 A1, Mar. 30, 2023
Int. Cl. H01L 21/683 (2006.01)
CPC H01L 21/6833 (2013.01) 14 Claims
OG exemplary drawing
 
1. A method of mounting conductive balls, the method comprising:
(a) horizontally arranging a mask including: a mask body in the form of a flat plate; a plurality of mounting grooves formed on a lower surface of the mask body to mount conductive balls therein; and a through hole formed inside the mounting groove and passing through the mask body;
(b) placing an electrostatic chuck above the mask;
(c) disposing, under the mask, a ball supply module in which a plurality of conductive balls are accommodated;
(d) mounting the conductive balls accommodated in the ball supply module into the mounting grooves by operating the electrostatic chuck;
(e) disposing a substrate under the mask by preparing the substrate on which flux is applied and transferring at least one of the mask and the substrate; and
(f) mounting the conductive balls on the substrate by increasing the distance between the electrostatic chuck and the mask to drop the conductive balls mounted in the mounting grooves of the mask onto the substrate.