US 12,217,994 B2
Electrostatic chuck device and sleeve for electrostatic chuck device
Nobuyoshi Yamazaki, Shizuoka (JP)
Assigned to TOMOEGAWA CORPORATION, Tokyo (JP)
Appl. No. 17/911,440
Filed by Tomoegawa Co., Ltd., Tokyo (JP)
PCT Filed Mar. 5, 2021, PCT No. PCT/JP2021/008815
§ 371(c)(1), (2) Date Sep. 14, 2022,
PCT Pub. No. WO2021/192935, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 2020-055844 (JP), filed on Mar. 26, 2020.
Prior Publication US 2023/0115256 A1, Apr. 13, 2023
Int. Cl. H01L 21/683 (2006.01); H01T 23/00 (2006.01)
CPC H01L 21/6833 (2013.01) 4 Claims
OG exemplary drawing
 
1. An electrostatic chuck device comprising:
a substrate,
a stack containing at least an internal electrode stacked on top of the substrate,
a ceramic layer stacked on an upper surface of the stack in a thickness direction,
a through-hole penetrating through the substrate and the stack in the thickness direction,
a sleeve formed from an insulating material and inserted in the through-hole, an upper surface of the sleeve in the thickness direction including a two-level structure having a first upper surface positioned coplanar with an upper surface of the substrate in the thickness direction, and a second upper surface positioned above the first upper surface in the thickness direction and disposed proximate to the ceramic layer, an edge portion of the stack in a plan view being disposed on top of the first upper surface,
wherein a space between an outside surface of the edge portion and an outside surface between the first upper surface and the second upper surface is either (i) filled with a filler or (ii) left as a void.