| CPC H01L 21/68 (2013.01) [B65G 47/90 (2013.01)] | 8 Claims | 

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               1. A wafer notch automated aligner, comprising: 
            a main body, having a wafer boat placement portion; 
                a wafer rotation mechanism, disposed on the main body and includes a rotor, a driving device and a first support, the rotor extending through the wafer boat placement portion, and forming an angle between an axis of the rotor and the main body greater than 0° and less than 90°, the driving device being located at a first side of the wafer boat placement portion, a driving shaft of the driving device being connected to a first end of the rotor, the first support being disposed on the main body, being located to a second side of the wafer boat placement portion, and supporting a second end of the rotor; and 
                a wafer positioning mechanism, disposed on the main body and comprising a positioning member, a base and a second support, the positioning member extending through the wafer boat placement portion, and an axis of the positioning member being parallel to the axis of the rotor, the base being disposed on the main body and located at the first side of the wafer boat placement portion, a first end of the positioning member being connected to the base, the second support being disposed on the main body, being located to the second side of the wafer boat placement portion, and supporting a second end of the positioning member; 
                a power supply device, disposed on the main body; and 
                a control device, disposed on the main body and being electrically connected to the driving device and the power supply device, wherein 
                the power supply device provides power to the control device, and 
                the control device controls the driving shaft of the driving device to drive the rotor to rotate. 
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