US 12,217,980 B2
Apparatus for processing a wafer, and method of controlling such an apparatus
Daniel Brien, Villach (AT); Pradeep Thirugnanam, Villach (AT); Matija Ponikvar, Villach (AT); and Alois Goller, Villach (AT)
Assigned to LAM RESEARCH AG, Villach (AT)
Appl. No. 17/424,994
Filed by LAM RESEARCH AG, Villach (AT)
PCT Filed Jan. 3, 2020, PCT No. PCT/EP2020/050076
§ 371(c)(1), (2) Date Jul. 22, 2021,
PCT Pub. No. WO2020/151932, PCT Pub. Date Jul. 30, 2020.
Claims priority of application No. 1900912 (GB), filed on Jan. 23, 2019.
Prior Publication US 2022/0084848 A1, Mar. 17, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67115 (2013.01) [H01L 21/67248 (2013.01); H01L 21/68764 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus for processing a wafer, the apparatus comprising:
a rotatable chuck adapted to receive the wafer;
a heating assembly comprising an array of light-emitting heating elements arranged to illuminate the wafer received by the rotatable chuck to heat the wafer, wherein the array of light-emitting heating elements is arranged to illuminate a first surface of the wafer when the wafer is received by the rotatable chuck, wherein the first surface is on an opposite side of the wafer than a second surface of the wafer, and wherein the second surface is exposed for processing when the wafer is received by the rotatable chuck;
a liquid dispenser arranged to dispense a liquid onto the second surface of the wafer; and
one or more light sensors arranged to detect light emitted by the array of light-emitting heating elements and configured to output a signal which is related to intensity of light emitted by the array of light-emitting heating elements,
wherein
the one or more light sensors comprise a light sensor positioned opposite to the array of light-emitting heating elements and arranged to be on an opposite side of the wafer compared to the array of light-emitting heating elements when the wafer is received by the rotatable chuck: or
the one or more light sensors comprise a light sensor arranged to detect light from the array of light-emitting heating elements that is reflected from the wafer when the wafer is received by the rotatable chuck.