US 12,217,978 B2
Etching device and etching method using the same
Wonje Cho, Osan-si (KR); and Duckjung Lee, Hwaseong-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., Ltd., Yongin-Si (KR)
Filed on Oct. 14, 2021, as Appl. No. 17/501,374.
Claims priority of application No. 10-2021-0003393 (KR), filed on Jan. 11, 2021.
Prior Publication US 2022/0223436 A1, Jul. 14, 2022
Int. Cl. H01L 21/67 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01)
CPC H01L 21/6708 (2013.01) [H05K 3/0088 (2013.01); H05K 3/068 (2013.01); H05K 2203/075 (2013.01); H05K 2203/1147 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An etching device comprising:
a nozzle unit including at least one nozzle including an etching solution injection hole, an etching solution collection hole, and a seal,
wherein the etching solution injection hole is configured to provide an etching solution to an etching object, the etching solution collection hole is configured to collect the etching solution, and
wherein the seal surrounds the etching solution injection hole and the etching solution collection hole to prevent the etching solution from leakage, and
wherein the etching solution collection hole is disposed in a level lower than a level where the etching solution injection hole is disposed, and
wherein the etching solution collection hole and the etching solution injection hole are separate and not in fluid communication with each other within the nozzle unit.