US 12,217,977 B2
Method and apparatus for treating substrate
Oh Yeol Kwon, Cheonan-si (KR); Soo Young Park, Incheon (KR); and Soo Yeon Shin, Suwon-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Feb. 4, 2022, as Appl. No. 17/665,233.
Claims priority of application No. 10-2021-0037865 (KR), filed on Mar. 24, 2021.
Prior Publication US 2022/0310415 A1, Sep. 29, 2022
Int. Cl. H01L 21/67 (2006.01); B08B 3/02 (2006.01); B08B 13/00 (2006.01); G05D 3/20 (2006.01); G06T 7/00 (2017.01); G06T 7/70 (2017.01)
CPC H01L 21/67051 (2013.01) [B08B 3/02 (2013.01); B08B 13/00 (2013.01); G05D 3/20 (2013.01); G06T 7/001 (2013.01); G06T 7/70 (2017.01); H01L 21/67259 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A substrate treating method comprising:
moving a first component of a substrate treatment device to a preset position in response to a treating process of the substrate treatment device;
detecting, by a plurality of position detection sensors, a position of the first component, wherein each of the plurality of position detection sensors includes a corresponding one of a plurality of magnetic detectors;
determining whether the first component is positioned at an abnormal position based on a result of the detecting of the position of the first component to generate a first result;
first vision-testing, by a vision sensor, a positional state of the first component; and
determining, after the determining that the first component is positioned at the abnormal position, whether the first component is position at a normal state based on a result of the vision-testing of the positional state of the first component to generate a second result; and
determining one of whether to stop the treating process of the process and whether to operate the treating process of the substrate based on the first and second results, taking a follow-up action in response to the determining of whether to stop the treating process of the process or operate the treating process of the substrate based on the first and second results; stopping an operation of the substrate treatment device when the first result is determined as an abnormal position and the second result is determined as an abnormal state; proceeding the treating process of the substrate device having the first component which is moved to the preset position when the first result is determined as an abnormal position and the second result is determined as a normal state.