US 12,217,976 B2
Method of fabricating package
Jiun-Yi Wu, Taoyuan (TW); and Chen-Hua Yu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 25, 2023, as Appl. No. 18/358,038.
Application 18/358,038 is a continuation of application No. 17/371,020, filed on Jul. 8, 2021, granted, now 11,756,801.
Prior Publication US 2023/0369066 A1, Nov. 16, 2023
Int. Cl. H01L 21/48 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01)
CPC H01L 21/4853 (2013.01) [H01L 21/4857 (2013.01); H01L 21/67121 (2013.01); H01L 24/97 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of fabricating a device, comprising:
providing a structure, wherein the structure comprises:
a carrier; and
plates, disposed in and in contact with the carrier, wherein each of the plates has a plurality of openings;
providing a plurality of conductive terminals above the plates, and introducing the plurality of conductive terminals into the plurality of openings of the plates;
providing a temporary carrier having a first surface and a second surface opposite to the first surface, wherein connection materials are disposed over the first surface;
turning the first surface of the temporary carrier downward and covering top surfaces of the plurality of conductive terminals;
flipping the temporary carrier and the structure, and then the plurality of conductive terminals in the plates are falling towards the connection materials, wherein at least one of the plates slides downward and separates from the carrier; and
removing the structure.