US 12,217,963 B2
Bonding apparatus, bonding system, and bonding method
Yutaka Yamasaki, Koshi (JP); and Takashi Terada, Koshi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Appl. No. 17/594,973
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Apr. 27, 2020, PCT No. PCT/JP2020/018007
§ 371(c)(1), (2) Date Nov. 4, 2021,
PCT Pub. No. WO2020/226093, PCT Pub. Date Nov. 12, 2020.
Claims priority of application No. 2019-088114 (JP), filed on May 8, 2019.
Prior Publication US 2022/0277979 A1, Sep. 1, 2022
Int. Cl. H01L 23/544 (2006.01); B23K 20/02 (2006.01); B23K 20/233 (2006.01); B23K 20/24 (2006.01); H01L 21/18 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/187 (2013.01) [B23K 20/02 (2013.01); B23K 20/233 (2013.01); B23K 20/24 (2013.01); H01L 21/67092 (2013.01); H01L 23/544 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A bonding apparatus configured to bond a first substrate and a second substrate, comprising:
a first holder configured to hold the first substrate;
a second holder disposed to face the first holder in a vertical direction, and configured to hold the second substrate;
a processing vessel accommodating the first holder and the second holder therein;
a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support supporting the first holder, the horizontal position adjuster being configured to adjust a horizontal position of the first holder; and
a pressing unit provided outside the processing vessel and connected to a central portion of the first holder, the pressing unit being configured to allow the first holder to approach the second holder to press the first substrate against the second substrate,
wherein the processing vessel comprises a first chamber provided at a first holder side and a second chamber provided at a second holder side, and is configured to be hermetically sealed by bringing the first chamber and the second chamber into contact with each other,
the bonding apparatus further comprises an elevating mechanism configured to move the first chamber up and down, and
a load applied to the first holder by the pressing unit in a state that the processing vessel is decompressed to be in a vacuum state is borne by a reaction force by the elevating mechanism and a pressure difference between an atmospheric pressure outside the processing vessel and a vacuum pressure inside the processing vessel.