US 12,217,954 B2
Method of cleaning a surface
Shaoren Deng, Ghent (BE); Andrea Illiberi, Leuven (BE); Daniele Chiappe, Espoo (FI); Eva Tois, Espoo (FI); Giuseppe Alessio Verni, Jodoigne (BE); Michael Givens, Oud-Heverlee (BE); Varun Sharma, Helsinki (FI); Chiyu Zhu, Helsinki (FI); Shinya Iwashita, Helsinki (FI); Charles Dezelah, Helsinki (FI); Viraj Madhiwala, Helsinki (FI); Jan Willem Maes, Wilrijk (BE); Marko Tuominen, Helsinki (FI); and Anirudhan Chandrasekaran, Herent (BE)
Assigned to ASM IP Holding B.V., Almere (NL)
Filed by ASM IP Holding B.V., Almere (NL)
Filed on Aug. 20, 2021, as Appl. No. 17/407,839.
Claims priority of provisional application 63/117,018, filed on Nov. 23, 2020.
Claims priority of provisional application 63/087,988, filed on Oct. 6, 2020.
Claims priority of provisional application 63/069,911, filed on Aug. 25, 2020.
Prior Publication US 2022/0068634 A1, Mar. 3, 2022
Int. Cl. H01L 21/02 (2006.01); B08B 3/08 (2006.01); B08B 5/00 (2006.01); C11D 7/02 (2006.01); C11D 7/24 (2006.01); C11D 7/26 (2006.01); C23C 16/02 (2006.01); H01L 21/285 (2006.01)
CPC H01L 21/02074 (2013.01) [B08B 3/08 (2013.01); B08B 5/00 (2013.01); C11D 7/02 (2013.01); C11D 7/245 (2013.01); C11D 7/261 (2013.01); C11D 7/264 (2013.01); C11D 7/265 (2013.01); C23C 16/0227 (2013.01); H01L 21/28562 (2013.01); C11D 2111/22 (2024.01)] 19 Claims
OG exemplary drawing
 
1. A method for cleaning a substrate, the method comprising:
providing a substrate comprising a dielectric and an oxidized metal surface, to a reaction chamber;
providing a reducing agent to the reaction chamber, thereby contacting the substrate with the reducing agent and converting the oxidized metal surface to a metal surface;
providing an oxidizing agent to the reaction chamber, thereby contacting the substrate with the oxidizing agent and oxidizing any metal contaminants on the dielectric surface, thus forming oxidized metal contaminants; and,
providing a cleaning agent to the reaction chamber, thereby contacting the substrate with the cleaning agent and removing the oxidized metal contaminants from the substrate,
wherein the cleaning agent comprises a halogen-containing beta diketonate.