US 12,217,945 B2
Sorption chamber walls for semiconductor equipment
Hossein Sadeghi, San Jose, CA (US); and Richard A. Gottscho, Pleasanton, CA (US)
Assigned to Lam Research Corporation, Fremont, CA (US)
Appl. No. 17/639,324
Filed by Lam Research Corporation, Fremont, CA (US)
PCT Filed Aug. 6, 2020, PCT No. PCT/US2020/045282
§ 371(c)(1), (2) Date Feb. 28, 2022,
PCT Pub. No. WO2021/045867, PCT Pub. Date Mar. 11, 2021.
Claims priority of provisional application 62/897,076, filed on Sep. 6, 2019.
Prior Publication US 2022/0319821 A1, Oct. 6, 2022
Int. Cl. B01D 53/04 (2006.01); H01J 37/32 (2006.01)
CPC H01J 37/32862 (2013.01) [B01D 53/04 (2013.01); B01D 53/0407 (2013.01); B01D 53/0438 (2013.01); B01D 53/0446 (2013.01); H01J 37/32522 (2013.01); H01J 37/32568 (2013.01); H01J 37/32816 (2013.01); B01D 2256/10 (2013.01); B01D 2259/40096 (2013.01); H01J 2237/002 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/334 (2013.01)] 27 Claims
OG exemplary drawing
 
1. A sorption structure integrated into a portion of a chamber used for processing a substrate, the sorption structure comprising:
an inner section having one or more heating elements;
a middle section having a coolant delivery network to receive and circulate a coolant from a coolant source and a plurality of vacuum conduits connected to a vacuum line, wherein the middle section is disposed adjacent to the inner section;
a lattice structure having an inner layer defined adjacent to the middle section and an outer layer defined adjacent to the inner layer and configured to face an interior region of the chamber, wherein the inner layer and the outer layer include a network of openings, and wherein the plurality of vacuum conduits are configured to connect to the lattice structure via the inner layer,
wherein the vacuum line and the plurality of vacuum conduits are configured to be used during processing to create a low pressure region in the lattice structure relative to a pressure in the chamber to adsorb by-products released in the chamber during the processing of the substrate.
 
20. A method for removing by-products using a sorption structure integrated in a portion of a chamber used for processing a substrate, the method comprising:
cooling the sorption structure to a first temperature by circulating a coolant from a coolant source through one or more channels of a coolant delivery network defined within a middle section of the sorption structure;
using a plurality of vacuum conduits defined in the middle section to create a low pressure region in a lattice structure defined adjacent to the middle section, the plurality of vacuum conduits being coupled to a vacuum line, wherein an outer layer of the lattice structure is exposed to an interior region of the chamber, the low pressure region causes the by-products present within the chamber to be adsorbed in a plurality of openings of the lattice structure;
heating the sorption structure to a second temperature using one or more heating elements defined in an inner section of the sorption structure, to release the by-products that have adsorbed in the plurality of openings of the lattice structure, wherein the middle section is disposed between the inner section and the lattice structure; and
removing the by-products released from the lattice structure through the plurality of vacuum conduits coupled to the vacuum line.