US 12,217,938 B2
To an inductively coupled plasma source
James Rogers, Los Gatos, CA (US); and John Poulose, Sunnyvale, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Nov. 3, 2022, as Appl. No. 17/980,527.
Application 17/980,527 is a continuation of application No. 15/727,998, filed on Oct. 9, 2017, granted, now 11,521,828.
Prior Publication US 2023/0052071 A1, Feb. 16, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/321 (2013.01) [H01J 37/32 (2013.01); H01J 37/3211 (2013.01); H01J 37/32183 (2013.01); H01J 37/32449 (2013.01); H01J 37/32522 (2013.01); H01J 37/32651 (2013.01); H01J 2237/026 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An apparatus for processing a substrate, comprising:
a top plate;
a coil comprising an inner coil and an outer coil, wherein the outer coil is disposed in a first plane, the inner coil including:
a first segment of the inner coil in the first plane and coupled to the outer coil; and
a second segment serially coupled to the first segment, wherein the second segment is configured in a vertical arrangement that extends the first segment out of the first plane and terminates at an inner diameter of the inner coil, and the second segment is separated from the outer coil by the first segment; and
inner and outer stanchions coupled to the top plate, wherein the inner coil is supported by the inner stanchions and the outer coil is supported by the outer stanchions, wherein the inner and outer stanchions extend from the top plate to support the coil away from the top plate.