US 12,217,915 B2
Multilayer electronic component
Hwi Dae Kim, Suwon-si (KR); Se Hwa Jeong, Suwon-si (KR); and Young Ghyu Ahn, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Dec. 12, 2022, as Appl. No. 18/079,438.
Claims priority of application No. 10-2021-0189811 (KR), filed on Dec. 28, 2021; and application No. 10-2022-0135054 (KR), filed on Oct. 19, 2022.
Prior Publication US 2023/0207220 A1, Jun. 29, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 2/065 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/224 (2013.01); H01G 4/232 (2013.01)] 31 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers interposed therebetween in a first direction; and
external electrodes connected to the internal electrodes,
wherein the body has first and second surfaces opposing each other in the first direction and one or more side surfaces positioned between the first and second surfaces,
the body has a protruding portion protruding in the first direction and outer peripheral portions around the protruding portion on the first surface of the body,
the external electrodes cover the outer peripheral portions, the side surfaces, and the second surface of the body,
in the second surface of the body, portions that are covered by the external electrodes and a portion that is not covered by the external electrodes are substantially coplanar with each other, and
respective uppermost surfaces of the external electrodes are lower than an uppermost surface of the protruding portion in the first direction.